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Rapidus Set to Install 10 EUV Chipmaking Tools in Japan, Boosting Tech Capabilities!

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By Harper Westfield

Rapidus Set to Install 10 EUV Chipmaking Tools in Japan, Boosting Tech Capabilities!

Photo of author

By Harper Westfield

Rapidus is set to incorporate up to 10 EUV lithography tools in its new fabrication plants in Japan, according to a report by TrendForce, which references Nikkan Kogyo Shimbun. These tools are intended for bulk manufacturing of semiconductor chips utilizing 2nm-class process technology starting in 2027.

Rapidus is gearing up to place 10 EUV lithography systems in its IIM-1 and IIM-2 chip production sites, revealed Atsuyoshi Koike, the CEO, during a discussion with Nikkan. In a significant advancement for Rapidus and a revitalization effort for the Japanese semiconductor sector, the first EUV lithography system designated for Japan landed at New Chitose Airport in December 2024.

While Atsuyoshi Koike didn’t specify the exact timeline for the EUV tools installation, it’s reasonable to anticipate that several cutting-edge lithography systems will be set up at IIM-1 within the next few years, with the rest to follow at IIM-2 subsequently.

The specific machines to be utilized were not detailed by the company; however, given that ASML’s Twinscan NXE:3800E is being installed, it is probable that these will be the tools used at IIM-1. A single Twinscan NXE:3800E scanner is capable of handling up to 220 wafers per hour at a dose of 30mj/cm^2, translating to 5280 wafers in 24 hours, assuming continuous operation, which is typically not the case as maintenance is needed.

Calculating the exact production capabilities of Rapidus’s IIM-2 based on the number of tools installed is challenging. At the 3nm scale, the total number of mask layers required might range from 100 to over 120, depending on the intricacy of the chip design. Out of these, 20 to 25 layers could be EUV layers, although this can vary based on the foundry and design specifics. If we assume that Rapidus’s 2nm-class process will involve 20 EUV layers, then with five EUV tools (assuming they are sufficiently operational), the foundry could handle roughly 17,000 to 20,000 wafers per month at IIM-1. This, however, is a preliminary estimate and the actual figures can vary significantly.

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Rapidus plans to initiate 2nm trial production on a pilot line at IIM-1 by April 2025. By June 2025, the company reportedly aims to provide 2nm chip samples to Broadcom, a key contract developer of AI and communication processors that collaborates with tech giants like Google and Meta. The goal is to commence mass production of 2nm chips at IIM-1 by 2027, with IIM-2 slated to begin operations later on.

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